SPECIFICATION

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SPECIFICATION
Device Name
:
Type Name
:
Spec. No.
:
Feb. 02 ’05
S.Miyashita
Feb. 02 ’05
M.W atanabe Y.Seki
Power Integrated Module
7MBR100U4B120
MS6M 0856
1
R e v i s e d
Date
Classification
Feb.-02 -’05
Enactment
Ind.
Content
R e c o r d s
Applied
date
Issued
date
Drawn
Checked
Checked Approved
M.W atanabe K.Yamada
2
Y.Seki
7MBR100U4B120
1. Outline Drawing ( Unit : mm )
LABEL
(
shows theoretical dimension.
) shows reference dimension.
2. Equivalent circuit
[ Converter ]
[ Brake ]
21(P)
[ Inverter ]
[ Thermistor ]
22(P1)
8
20
(Gu)
1(R)
2(S)
3(T)
19(Eu)
7(B)
14(Gb)
23(N)
24(N1)
13(Gx)
18
(Gv)
16
(Gw)
17(Ev)
4(U)
15(Ew)
5(V)
12(Gy)
11(Gz)
6(W)
10(En)
3
9
3.Absolute Maximum Ratings ( at Tc= 25°C unless otherwise specified )
Items
Inverter
Collector-Emitter voltage
Gate-Emitter voltage
Collector current
Brake
Collector Power Dissipation
Collector-Emitter voltage
Gate-Emitter voltage
Conditions
VCES
VGES
Ic
Continuous
Icp
1ms
-Ic
-Ic pulse
Pc
VCES
VGES
Ic
Continuous
Icp
1ms
Pc
1 device
Repetitive peak reverse Voltage (Diode)
VRRM
Repetitive peak reverse Voltage
VRRM
Average Output Current
Surge Current (Non-Repetitive)
2
It
(Non-Repetitive)
Junction temperature
Storage temperature
Isolation between terminal and copper base (*1)
voltage between thermistor and others (*2)
Screw
Torque
Mounting
(*3)
Io
IFSM
2
Units
1200
±20
V
V
100
Tc=80°C
150
100
200
390
1200
±20
75
200
A
W
V
V
Tc=25°C
50
Tc=80°C
Tc=25°C
Tc=80°C
35
100
70
205
W
1200
V
1600
V
100
A
50Hz/60Hz
sine wave
Tj=150°C, 10ms
It
Tj
Tstg
half sine wave
Viso
AC : 1min.
-
Maximum
Ratings
Tc=25°C
Tc=80°C
Tc=25°C
1ms
1 device
Collector current
Collector Power Dissipation
Converter
Symbols
A
520
A
1352
150
-40 ~ +125
A2s
2500
VAC
3.5
Nm
°C
(*1) All terminals should be connected together when isolation test will be done.
(*2) Two thermistor terminals should be connected together, each other terminals should be connected together
and shorted to base plate when isolation test will be done.
(*3) Recommendable Value : 2.5~3.5 Nm (M5)
4
4. Electrical characteristics ( at Tj= 25°C unless otherwise specified)
Items
Zero gate voltage
Collector current
ICES
Gate-Emitter
leakage current
IGES
Gate-Emitter
threshold voltage
Inverter
Collector-Emitter
saturation voltage
Input capacitance
Turn-on time
Turn-off time
Forward on voltage
Brake
Reverse recovery time
VCE(sat)
(terminal)
VCE(sat)
(chip)
Cies
ton
tr
tr (i)
toff
tf
Tj= 25°C
Tj=125°C
Tj= 25°C
Ic = 100A
Tj=125°C
VCE=10V,VGE=0V,f=1MHz
Vcc = 600V
Ic = 100A
VGE=±15V
Rg = 9.1 Ω
VGE=15V
Tj= 25°C
Tj=125°C
VF
(chip)
IF = 100A
Tj= 25°C
Tj=125°C
trr
IGES
Reverse current
VGE = 0V
VCE = 1200V
VCE = 0V
VGE=±20V
VCE = 20V
Ic = 100mA
VGE=0V
Gate-Emitter
leakage current
Collector-Emitter
saturation voltage
Conditions
VF
(terminal)
ICES
Turn-off time
Converter
VGE(th)
Zero gate voltage
Collector current
Turn-on time
Thermistor
Symbols
IF = 100A
VGE = 0V
VCE = 1200V
VCE = 0V
VGE=±20V
VCE(sat)
(terminal)
VGE=15V
VCE(sat)
(chip)
Ic = 50A
ton
tr
toff
tf
IRRM
Forward on voltage
VFM
Reverse current
IRRM
Resistance
R
B value
B
Vcc = 600V
Ic = 50A
VGE=±15V
Rg = 33 Ω
VR=1200V
VGE=0V
IF = 100A
VR=1600V
T = 25°C
T =100°C
T = 25/50°C
Tj= 25°C
Tj=125°C
Tj= 25°C
Tj=125°C
terminal
chip
Characteristics
min.
typ.
max.
Units
-
-
1.0
mA
-
-
200
nA
4.5
6.5
8.5
V
-
2.60
2.95
2.10
2.45
8
0.38
0.13
0.03
0.41
0.07
2.60
2.90
2.85
2.35
1.20
0.60
1.00
0.30
2.85
-
-
2.10
2.40
-
2.35
0.35
μs
-
-
1.0
mA
-
-
200
nA
465
3305
2.25
2.60
2.00
2.35
0.53
0.43
0.37
0.07
1.55
1.40
5000
495
3375
2.65
2.40
1.20
0.60
1.00
0.30
1.0
1.90
1.0
520
3450
5
V
nF
μs
V
V
μs
mA
V
mA
Ω
K
5. Thermal resistance characteristics
Items
Symbols
Thermal resistance(1device)
Rth(j-c)
Contact Thermal resistance
Rth(c-f)
(1device) (*4)
Characteristics
min.
typ.
max.
Conditions
Inverter IGBT
-
-
0.32
Inverter FWD
-
-
0.58
Brake IGBT
-
-
0.60
Converter Diode
-
-
0.50
with Thermal Compound
-
0.05
-
Units
°C/W
(*4) This is the value which is defined mounting on the additional cooling fin with thermal compound.
6. Indication on module
Logo of production
7MBR100U4B120
100A 1200V
Lot.No.
Place of manufacturing (code)
7.Applicable category
This specification is applied to Power Integrated Module named 7MBR100U4B120 .
8.Storage and transportation notes
・ The module should be stored at a standard temperature of 5 to 35°C and humidity of 45 to 75% .
・ Store modules in a place with few temperature changes in order to avoid condensation on the module surface.
・ Avoid exposure to corrosive gases and dust.
・ Avoid excessive external force on the module.
・ Store modules with unprocessed terminals.
・ Do not drop or otherwise shock the modules when transporting.
~
~
9. Definitions of switching time
90%
0V
0V
V GE
L
tr r
Ir r
Ic
90%
10%
10%
~
~
0V
0A
V CE
Ic
90%
Vcc
RG
~
~
V CE
10%
V CE
tr ( i )
V GE
Ic
tr
tf
to f f
to n
10. Packing and Labeling
Display on the packing box
- Logo of production
- Type name
- Lot No
- Products quantity in a packing box
6
11. Reliability test results
Reliability Test Items
Mechanical Tests
Test
categories
Test items
(Aug.-2001 edition)
1 Terminal Strength
(Pull test)
2 Mounting Strength
Pull force
Test time
Screw torque
Test time
3 Vibration
Range of frequency : 10 ~ 500Hz
Sweeping time
: 15 min.
Acceleration
: 100m/s2
Sweeping direction : Each X,Y,Z axis
Test time
: 6 hr. (2hr./direction)
Maximum acceleration : 5000m/s2
Pulse width
: 1.0msec.
Direction
: Each X,Y,Z axis
Test time
: 3 times/direction
Solder temp.
: 235±5 ℃
Immersion time
: 5±0.5sec.
Test time
: 1 time
Each terminal should be Immersed in solder
within 1~1.5mm from the body.
Solder temp.
: 260±5 ℃
Immersion time
: 10±1sec.
Test time
: 1 time
Each terminal should be Immersed in solder
within 1~1.5mm from the body.
Storage temp.
: 125±5 ℃
Test duration
: 1000hr.
Storage temp.
: -40±5 ℃
Test duration
: 1000hr.
Storage temp.
: 85±2 ℃
Relative humidity
: 85±5%
Test duration
: 1000hr.
Test temp.
: 120±2 ℃
Test humidity
: 85±5%
Test duration
: 96hr.
4 Shock
5 Solderabitlity
6 Resistance to
Soldering Heat
1 High Temperature
Storage
2 Low Temperature
Storage
3 Temperature
Humidity
Storage
4 Unsaturated
Pressurized Vapor
Environment Tests
Reference
Number Acceptnorms
of
ance
EIAJ ED-4701
sample number
Test methods and conditions
5 Temperature
Cycle
Test temp.
:
:
:
:
:
20N
10±1 sec.
2.5 ~ 3.5 N・m (M5)
10±1 sec.
Test Method 401
MethodⅠ
Test Method 402
methodⅡ
5
(0:1)
5
(0:1)
Test Method 403
Reference 1
Condition code B
5
(0:1)
Test Method 404
Condition code B
5
(0:1)
Test Method 303
Condition code A
5
(0:1)
Test Method 302
Condition code A
5
(0:1)
Test Method 201
5
(0:1)
Test Method 202
5
(0:1)
Test Method 103
Test code C
5
(0:1)
Test Method 103
Test code E
5
(0:1)
Test Method 105
5
(0:1)
Test Method 307
method Ⅰ
Condition code A
5
(0:1)
Low temp. -40±5 ℃
High temp. 125 ±5 ℃
Number of cycles
RT 5 ~ 35 ℃
: High ~ RT ~ Low ~ RT
1hr. 0.5hr. 1hr. 0.5hr.
: 100 cycles
Test temp.
:
Dwell time
6 Thermal Shock
High temp. 100
+0
-5
+5
-0
℃
Low temp. 0 ℃
Used liquid : Water with ice and boiling water
Dipping time
: 5 min. par each temp.
Transfer time
: 10 sec.
Number of cycles
: 10 cycles
7
Reliability Test Items
Test
categories
Test items
(Aug.-2001 edition)
1 High temperature
Reverse Bias
Test temp.
Bias Voltage
Bias Method
Endurance
Endurance
Tests Tests
Reference
Number Acceptnorms
of
ance
EIAJ ED-4701
sample number
Test methods and conditions
Test duration
2 High temperature
Bias (for gate)
Test temp.
Test duration
: Ta = 125±5 ℃
(Tj ≦ 150 ℃)
: VC = VGE = +20V or -20V
: Applied DC voltage to G-E
VCE = 0V
: 1000hr.
Test temp.
Relative humidity
Bias Voltage
Bias Method
:
:
:
:
Test duration
ON time
OFF time
Test temp.
:
:
:
:
Number of cycles
:
Bias Voltage
Bias Method
3 Temperature
Humidity Bias
4 Intermitted
Operating Life
(Power cycle)
( for IGBT )
Test Method 101
5
(0:1)
Test Method 101
5
(0:1)
Test Method 102
Condition code C
5
(0:1)
Test Method 106
5
(0:1)
: Ta = 125±5 ℃
(Tj ≦ 150 ℃)
: VC = 0.8×VCES
: Applied DC voltage to C-E
VGE = 0V
: 1000hr.
85±2 oC
85±5%
VC = 0.8×VCES
Applied DC voltage to C-E
VGE = 0V
1000hr.
2 sec.
18 sec.
Tj=100±5 deg
Tj ≦ 150 ℃, Ta=25±5 ℃
15000 cycles
Failure Criteria
Item
Characteristic
Symbol
Electrical
Leakage current
ICES
characteristic
±IGES
Gate threshold voltage VGE(th)
Saturation voltage
VCE(sat)
Forward voltage
VF
Thermal
IGBT
VGE
resistance
or VCE
FWD
VF
Isolation voltage
Viso
Visual
Visual inspection
inspection
Peeling
Plating
and the others
Failure criteria
Unit
Lower limit Upper limit
LSL×0.8
-
USL×2
USL×2
USL×1.2
USL×1.2
USL×1.2
USL×1.2
mA
A
mA
V
V
mV
USL×1.2
Broken insulation
mV
-
The visual sample
Note
-
LSL : Lower specified limit.
USL : Upper specified limit.
Note : Each parameter measurement read-outs shall be made after stabilizing the components
at room ambient for 2 hours minimum, 24 hours maximum after removal from the tests.
And in case of the wetting tests, for example, moisture resistance tests, each component
shall be made wipe or dry completely before the measurement.
8
Reliability Test Results
Test
categorie
s
Test items
Mechanical Tests
1 Terminal Strength
(Pull test)
2 Mounting Strength
Number
Reference
Number
of
norms
of test
failure
EIAJ ED-4701
sample
(Aug.-2001 edition)
sample
Test Method 401
5
0
5
0
MethodⅠ
Test Method 402
methodⅡ
3 Vibration
Test Method 403
5
0
4 Shock
Condition code B
Test Method 404
5
0
5
0
Condition code B
5 Solderabitlity
Test Method 303
Environment Tests
Condition code A
6 Resistance to Soldering Heat
Test Method 302
5
0
1 High Temperature Storage
Condition code A
Test Method 201
5
0
2 Low Temperature Storage
Test Method 202
5
0
3 Temperature Humidity
Storage
4 Unsaturated
Pressurized Vapor
Test Method 103
5
*
5
0
5 Temperature Cycle
Test Method 105
5
0
6 Thermal Shock
Test Method 307
5
0
1 High temperature Reverse Bias Test Method 101
5
*
Test Method 101
5
0
Test Method 102
5
*
5
0
Test code C
Test Method 103
Test code E
method Ⅰ
Endurance Tests
Condition code A
2 High temperature Bias
( for gate )
3 Temperature Humidity Bias
Condition code C
4 Intermitted Operating Life
(Power cycling)
( for IGBT )
Test Method 106
* under confirmation
9
[ Inverter ]
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 25°C / chip
[ Inverter ]
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 125°C / chip
200
200
VGE=20V 15V
12V
Collector current : Ic [A]
Collector current : Ic [A]
VGE=20V 15V
150
100
10V
50
12V
150
100
10V
50
8V
8V
0
0
0
1
2
3
4
0
5
1
Collector-Emitter voltage : VCE [V]
[ Inverter ]
4
5
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)
Tj=25°C / chip
10
Collector - Emitter voltage : VCE [ V ]
200
Collector current : Ic [A]
3
[ Inverter ]
Collector current vs. Collector-Emitter voltage (typ.)
VGE=15V / chip
Tj=25°C
150
Tj=125°C
100
50
8
6
4
Ic=150A
Ic=75A
Ic=37.5A
2
0
0
0
1
2
3
4
5
5
Collector-Emitter voltage : VCE [V]
Cies
Cres
1.0
Coes
0.1
0
10
20
Collector-Emitter voltage : VCE [V]
15
20
25
[ Inverter ]
Dynamic Gate charge (typ.)
Vcc=600V, Ic=100A,Tj= 25°C
Collector-Emitter voltage : VCE [ 200V/div ]
Gate - Emitter voltage : VGE
[ 5V/div ]
100.0
10.0
10
Gate-Emitter voltage : VGE [V]
[ Inverter ]
Capacitance vs. Collector-Emitter voltage (typ.)
VGE=0V, f= 1MHz, Tj= 25°C
Capacitance : Cies, Coes, Cres [ nF ]
2
Collector-Emitter voltage : VCE [V]
30
VGE
VCE
0
0
100
200
300
400
Gate charge : Qg [nC]
10
[ Inverter ]
Switching time vs. Collector current (typ.)
Vcc=600V, VGE=±15V, Rg=9.1Ω, Tj= 25°C
[ Inverter ]
Switching time vs. Collector current (typ.)
Vcc=600V, VGE=±15V, Rg=9.1Ω, Tj=125°C
10000
Switching time : ton, tr, toff, tf [ nsec ]
Switching time : ton, tr, toff, tf [ nsec ]
10000
1000
toff
ton
tr
100
tf
1000
ton
toff
tr
100
10
tf
10
0
50
100
150
0
Collector current : Ic [A]
50
[ Inverter ]
Switching loss vs. Collector current (typ.)
Vcc=600V, VGE=±15V, Rg=9.1Ω
Switching loss : Eon, Eoff, Err [mJ/pulse ]
Switching time : ton, tr, toff, tf [ nsec ]
10000
ton
toff
tr
100
tf
10
14
Eon(125°C)
12
Eon(25°C)
Eoff(125°C)
10
8
Err(125°C)
6
Eoff(25°C)
4
Err(25°C)
2
0
1
10
100
1000
0
Gate resistance : Rg [Ω]
50
100
150
Collector current : Ic [A]
[ Inverter ]
Switching loss vs. Gate resistance (typ.)
Vcc=600V, Ic=100A, VGE=±15V, Tj= 125°C
[ Inverter ]
Reverse bias safe operating area (max.)
+VGE=15V,-VGE <= 15V, RG >= 9.1Ω ,Tj <= 125°C
40
250
Eon
200
30
Collector current : Ic [A]
Switching loss : Eon, Eoff, Err [mJ/pulse ]
150
[ Inverter ]
Switching time vs. Gate resistance (typ.)
Vcc=600V, Ic=100A, VGE=±15V, Tj= 25°C
1000
100
Collector current : Ic [A]
20
Eoff
10
150
100
50
Err
0
0
1
10
100
Gate resistance : Rg [Ω]
1000
0
400
800
1200
Collector-Emitter voltage : VCE [V]
11
[ Inverter ]
Forward current vs. Forward on voltage (typ.)
chip
[ Inverter ]
Reverse recovery characteristics (typ.)
Vcc=600V, VGE=±15V, Rg=9.1Ω
1000
Tj=25°C
100
Forward current : IF [A]
Reverse recovery current : Irr [ A ]
Reverse recovery time : trr [ nsec ]
120
Tj=125°C
80
60
40
20
trr (125°C)
trr (25°C)
100
Irr (125°C)
Irr (25°C)
10
0
0
1
2
3
0
4
25
50
75
100
125
Forward current : IF [A]
Forward on voltage : VF [V]
[ Converter ]
Forward current vs. Forward on voltage (typ.)
chip
120
Tj=25°C
Forward current : IF [A]
100
80
Tj=125°C
60
40
20
0
0.0
0.5
1.0
1.5
2.0
2.5
Forward on voltage : VFM [V]
[ Thermistor ]
Transient thermal resistance (max.)
Temperature characteristic (typ.)
100
IGBT[Brake]
FW D[Inverter]
Conv. Diode
IGBT[Inverter]
0.100
0.010
0.001
Resistance : R [kΩ]
Thermal resistanse : Rth(j-c) [ °C/W ]
1.000
10
1
0.1
0.010
0.100
Pulse width : Pw [sec]
1.000
-60 -40 -20
0
20
40
60
80 100 120 140 160 180
Temperature [°C ]
12
[ Brake ]
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 25°C / chip
[ Brake ]
Collector current vs. Collector-Emitter voltage (typ.)
Tj= 125°C / chip
80
80
VGE=20V 15V
VGE=20V 15V
70
60
Collector current : Ic [A]
Collector current : Ic [A]
70
12V
50
10V
40
30
20
10
60
50
40
10V
30
20
10
8V
8V
0
0
0
1
2
3
4
0
5
[ Brake ]
Collector current vs. Collector-Emitter voltage (typ.)
VGE=15V / chip
2
3
4
5
[ Brake ]
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.)
Tj=25°C / chip
10
70
Collector - Emitter voltage : VCE [ V ]
80
Collector current : Ic [A]
1
Collector-Emitter voltage : VCE [V]
Collector-Emitter voltage : VCE [V]
Tj=25°C
60
50
Tj=125°C
40
30
20
10
8
6
4
Ic=70A
Ic=35A
Ic=17.5A
2
0
0
0
1
2
3
4
5
5
[ Brake ]
Capacitance vs. Collector-Emitter voltage (typ.)
VGE=0V, f= 1MHz, Tj= 25°C
Cies
1.0
Cres
Coes
0.1
10
20
Collector-Emitter voltage : VCE [V]
15
20
25
[ Brake ]
Dynamic Gate charge (typ.)
Vcc=600V, Ic=50A,Tj= 25°C
Collector-Emitter voltage : VCE [ 200V/div ]
Gate - Emitter voltage : VGE
[ 5V/div ]
10.0
0
10
Gate-Emitter voltage : VGE [V]
Collector-Emitter voltage : VCE [V]
Capacitance : Cies,Coes,Cres [nF]
12V
30
VGE
VCE
0
0
50
100
150
200
Gate charge : Qg [nC]
13
Warnings
- This product shall be used within its absolute maximum rating (voltage, current, and temperature). This product
may be broken in case of using beyond the ratings. If Printed Circuit Board is not suitable, the main pin terminals
may have higher temperature than Tstg. Also the pin terminals shall be used within Tstg.
製品の絶対最大定格(電圧,電流,温度等)の範囲内で御使用下さい。絶対最大定格を超えて使用すると、素子が破壊する
場合があります。また、使用するプリント板が不適切な場合、主端子ピンの温度がTstg以上になることがあります。主端子ピン
もTstg範囲内でご使用下さい。
- Connect adequate fuse or protector of circuit between three-phase line and this product to prevent the equipment
from causing secondary destruction, such as fire, its spreading, or explosion.
万一の不慮の事故で素子が破壊した場合を考慮し、商用電源と本製品の間に適切な容量のヒューズ又はブレーカーを必ず
付けて火災,爆発,延焼等の2次破壊を防いでください。
- Use this product after realizing enough working on environment and considering of product's reliability life.
This product may be broken before target life of the system in case of using beyond the product's reliability life.
製品の使用環境を十分に把握し、製品の信頼性寿命が満足できるか検討の上、本製品を適用して下さい。製品の信頼性寿命
を超えて使用した場合、装置の目標寿命より前に素子が破壊する場合があります。
- When electric power is connected to equipments, rush current will be flown through rectifying diode to charge
2
DC capacitor. Guaranteed value of the rush current is specified as I t (non-repetitive), however frequent rush
current through the diode might make it's power cycle destruction occur because of the repetitive power.
In application which has such frequent rush current, well consideration to product life time (i.e. suppressing
the rush current) is necessary.
電源投入時に整流用ダイオードには、コンデンサーを充電する為の突入電流が流れます。この突入電流に対する保証値は
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I t(非繰返し)として表記されていますが、この突入電流が頻繁に流れるとI t破壊とは別に整流用ダイオードの繰返し負荷に
よるパワーサイクル耐量破壊を起こす可能性があります。突入電流が頻繁に流れるようなアプリケーションでは、突入電流値
を抑えるなど、製品寿命に十分留意してご使用下さい。
- If the product had been used in the environment with acid, organic matter, and corrosive gas ( hydrogen sulfide,
sulfurous acid gas), the product's performance and appearance can not be ensured easily.
酸・有機物・腐食性ガス(硫化水素,亜硫酸ガス等)を含む環境下で使用された場合、製品機能・外観等の保証はできません。
- Use this product within the power cycle curve (Technical Rep.No. : MT5F12959). Power cycle capability is
classified to delta-Tj mode which is stated as above and delta-Tc mode. Delta-Tc mode is due to rise and down
of case temperature (Tc), and depends on cooling design of equipment which use this product. In application
which has such frequent rise and down of Tc, well consideration of product life time is necessary.
本製品は、パワーサイクル寿命カーブ以下で使用下さい(技術資料No.: MT5F12959)。パワーサイクル耐量にはこのΔTjによる
場合の他に、ΔTcによる場合があります。これはケース温度(Tc)の上昇下降による熱ストレスであり、本製品をご使用する際
の放熱設計に依存します。ケース温度の上昇下降が頻繁に起こる場合は、製品寿命に十分留意してご使用下さい。
- Never add mechanical stress to deform the main or control terminal. The deformed terminal may cause poor
contact problem.
主端子及び制御端子に応力を与えて変形させないで下さい。 端子の変形により、接触不良などを引き起こす場合があります。
- Use this product with keeping the cooling fin's flatness between screw holes within 100um at 100mm and the
roughness within 10um. Also keep the tightening torque within the limits of this specification. Too large convex
of cooling fin may cause isolation breakdown and this may lead to a critical accident. On the other hand, too
large concave of cooling fin makes gap between this product and the fin bigger, then, thermal conductivity will
be worse and over heat destruction may occur.
冷却フィンはネジ取り付け位置間で平坦度を100mmで100um以下、表面の粗さは10um以下にして下さい。 過大な凸反り
があったりすると本製品が絶縁破壊を起こし、重大事故に発展する場合があります。また、過大な凹反りやゆがみ等があると、
本製品と冷却フィンの間に空隙が生じて放熱が悪くなり、熱破壊に繋がることがあります。
- In case of mounting this product on cooling fin, use thermal compound to secure thermal conductivity. If the
thermal compound amount was not enough or its applying method was not suitable, its spreading will not be
enough, then, thermal conductivity will be worse and thermal run away destruction may occur.
Confirm spreading state of the thermal compound when its applying to this product.
(Spreading state of the thermal compound can be confirmed by removing this product after mounting.)
素子を冷却フィンに取り付ける際には、熱伝導を確保するためのコンパウンド等をご使用ください。又、塗布量が不足したり、
塗布方法が不適だったりすると、コンパウンドが十分に素子全体に広がらず、放熱悪化による熱破壊に繋がる事があります。
コンパウンドを塗布する際には、製品全面にコンパウンドが広がっている事を確認してください。
(実装した後に素子を取りはずすとコンパウンドの広がり具合を確認する事が出来ます。)
- It shall be confirmed that IGBT's operating locus of the turn-off voltage and current are within the RBSOA
specification. This product may be broken if the locus is out of the RBSOA.
ターンオフ電圧・電流の動作軌跡がRBSOA仕様内にあることを確認して下さい。RBSOAの範囲を超えて使用すると素子が破壊
する可能性があります。
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Warnings
- If excessive static electricity is applied to the control terminals, the devices may be broken. Implement some
countermeasures against static electricity.
制御端子に過大な静電気が印加された場合、素子が破壊する場合があります。取り扱い時は静電気対策を実施して下さい。
- Never add the excessive mechanical stress to the main or control terminals when the product is applied to
equipments. The module structure may be broken.
素子を装置に実装する際に、主端子や制御端子に過大な応力を与えないで下さい。端子構造が破壊する可能性があります。
- In case of insufficient -VGE, erroneous turn-on of IGBT may occur. -VGE shall be set enough value to prevent
this malfunction. (Recommended value : -VGE = -15V)
逆バイアスゲート電圧-VGEが不足しますと誤点弧を起こす可能性があります。誤点弧を起こさない為に-VGEは十分な値で
設定して下さい。 (推奨値 : -VGE = -15V)
- In case of higher turn-on dv/dt of IGBT, erroneous turn-on of opposite arm IGBT may occur. Use this product in
the most suitable drive conditions, such as +VGE, -VGE, RG to prevent the malfunction.
ターンオン dv/dt が高いと対抗アームのIGBTが誤点弧を起こす可能性があります。誤点弧を起こさない為の最適なドライブ
条件(+VGE, -VGE, RG等)でご使用下さい。
- This product may be broken by avalanche in case of VCE beyond maximum rating VCES is applied between
C-E terminals. Use this product within its absolute maximum voltage.
VCESを超えた電圧が印加された場合、アバランシェを起こして素子破壊する場合があります。VCEは必ず絶対定格の範囲内
でご使用下さい。
Cautions
- Fuji Electric Device Technology is constantly making every endeavor to improve the product quality and reliability.
However, semiconductor products may rarely happen to fail or malfunction. To prevent accidents causing injury or
death, damage to property like by fire, and other social damage resulted from a failure or malfunction of
the Fuji Electric Device Technology semiconductor products, take some measures to keep safety such as redundant
design, spread-fire-preventive design, and malfunction-protective design.
富士電機デバイステクノロジーは絶えず製品の品質と信頼性の向上に努めています。しかし、半導体製品は故障が発生したり、
誤動作する場合があります。富士電機デバイステクノロジー製半導体製品の故障または誤動作が、結果として人身事故・火災
等による財産に対する損害や社会的な損害を起こさないように冗長設計・延焼防止設計・誤動作防止設計など安全確保
のための手段を講じて下さい。
- The application examples described in this specification only explain typical ones that used the Fuji Electric Device
Technology products. This specification never ensure to enforce the industrial property and other rights, nor license the
enforcement rights.
本仕様書に記載してある応用例は、富士電機デバイステクノロジー製品を使用した代表的な応用例を説明するものであり、
本仕様書によって工業所有権、その他権利の実施に対する保障または実施権の許諾を行うものではありません。
- The product described in this specification is not designed nor made for being applied to the equipment or
systems used under life-threatening situations. When you consider applying the product of this specification
to particular used, such as vehicle-mounted units, shipboard equipment, aerospace equipment, medical devices,
atomic control systems and submarine relaying equipment or systems, please apply after confirmation
of this product to be satisfied about system construction and required reliability.
本仕様書に記載された製品は、人命にかかわるような状況下で使用される機器あるいはシステムに用いられることを
目的として設計・製造されたものではありません。本仕様書の製品を車両機器、船舶、航空宇宙、医療機器、原子力
制御、海底中継機器あるいはシステムなど、特殊用途へのご利用をご検討の際は、システム構成及び要求品質に
満足することをご確認の上、ご利用下さい。
If there is any unclear matter in this specification, please contact Fuji Electric Device Technology Co.,Ltd.
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